Semiconductor Network (Korea) STT-MRAM(Spin Transfer Torque Magnetic Random Access Memory ; 스핀 전달 토크 자기 메모리)은 빠르고 휘발성이 없으며 내구성이 뛰어날 뿐 아니라 저전력의...
Caroline Demoerloose
MRAM Evolves In Multiple Directions
Semiconductor Engineering| Bryon MOYER | March 11TH, 2021 Magnetoresistive RAM (MRAM) is one of several new non-volatile memory technologies...
VIEWPOINT 2021: Siamak Salimy, CTO/Co-Founder, Hprobe
Semiconductor packaging news | February 12, 2021 Despite initial market uncertainties, the societal changes wrought by the 2020 Covid-19 pandemic...
Hprobe, Leader in Magnetic Field Testing Creates Subsidiary in Germany and Receives First Order from Fraunhofer IPMS
Grenoble, France, January 26, 2021 – Hprobe, a provider of turnkey semiconductor Automatic Test Equipment (ATE) for magnetic devices, today...
Spintronic devices: a promising alternative to CMOS devices
Journal of Computational Electronics | 19 January 2021 Abstract The field of spintronics has attracted tremendous attention recently owing to its...
Technology Optimization for Magnetoresistive RAM (STT-MRAM)
SemiWiki | Tom Dillinger | 01/06/2021 Spin-transfer torque magnetoresistive RAM (STT-MRAM) has emerged from several foundries as a very attractive...
Hprobe Claims To Have The Primary Turnkey Check Gear For 3D Magnetic Sensors
Radio Technology News Daily Press | Dec 15, 2020 The equipment is based on Hprobe’s 3D magnetic field generator technology for single and...
HPROBE LANCE UN SYSTÈME ATE POUR CAPTEURS MAGNÉTIQUES 3D
MESURES | Cédric LARDIERE | 16/11/2020 Le français dévoile le premier équipement de test clé-en-main de l’industrie dédié aux capteurs magnétiques...
How to Use MRAM to Improve Reliability, Lower Latencies, and Reduce Power for Edge Computing
DIGI-KEY| Jeff Shepard| 2020-11-05 The use of edge computing is growing across applications such as the Industrial Internet of Things (IIoT),...
GMR technology saves fuel economy in automobiles
Power Electronics News | March 23, 2020 The automotive industry continues to push for more efficient fuel consumption and reduced carbon dioxide...
HPROBE LANCE UN SYSTÈME ATE POUR CAPTEURS MAGNÉTIQUES 3D
Electroniques | Cédric LARDIERE | 15/10/2020 Le français dévoile le premier équipement de test clé-en-main de l’industrie dédié aux capteurs...
Automated Test Equipment for 3D Magnetic Sensors
EE Times Europe | Anne-Françoise PELE | October 14, 2020 Steady demand for magnetic sensors in cars and IIoT applications is driving the growth of...
Automated test equipment dedicated to 3D magnetic sensors
Electronic Specifier | Alex Lynn | 7th October 2020 Hprobe has announced the first industry turnkey testing equipment dedicated to 3D magnetic...
First automated test system for 3D magnetic sensors for automotive and industrial
EEnEWS Europe | Nick Flaherty | October 01, 2020 Hprobe has launched the first industry turnkey testing equipment dedicated to 3D magnetic...
Hprobe Claims First Automated Test Equipment Dedicated to 3D Magnetic Sensors for Automotive and Industrial Apps
Evaluation Engineering | Oct 2nd, 2020 The ATE system addresses the crucial step of chip sorting for the new generation of magnetic sensors tested...
IEDM Conference to be held December 12-16, 2020
Hprobe will be attending virtually the IEDM Conference to be held December 12-16, 2020.
Hprobe Announces First Automated Test Equipment Dedicated to 3D Magnetic Sensors for Automotive and Industrial Applications
SEMICONDUCTOR DIGEST | Shannon Davis | October 2020 Hprobe, a provider of semiconductor Automated Test Equipment (ATE) for magnetic devices, today...
Hprobe claims first turnkey test equipment dedicated to 3D Magnetic sensors
Electronics Weekly | David Manners | 2nd October 2020 Hprobe, a provider of ATE for magnetic devices, today announced turnkey testing equipment...
Hprobe Announces First Automated Test Equipment Dedicated to 3D Magnetic Sensors for Automotive and Industrial Applications
Grenoble, France, October 1, 2020 – Hprobe, a provider of semiconductor Automated Test Equipment (ATE) for magnetic devices, today announced the...
DRAM, 3D NAND Face New Challenges
Semiconductor Engineering | Mark LAPEDUS | September 21ST, 2020 It’s been a topsy-turvy period for the memory market, and it’s not over. So far in...